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PIC Awards - rewarding excellence, innovation and success

https://picawards.net

Intengent is shortlisted for the prestigious PIC Award in the category Best Achievement in PIC Platform for development and commercialization of its flagship PIC technology – Taper-Assisted Vertical Integration (TAVI)

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Compound Semiconductors International Conference (CS International 2019)

March 26th 2019, Brussels, Belgium www.cs-international.net

Intengent's President and CEO Dr. Valery Tolstikhin will be giving an invited presentation entitled: "Fabless PICs in InP: Why, What, and How?"

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6th Workshop on Photonic Integrated Circuits at Optical Fiber Communications Conference (OFC 2019)

March 6th 2019, San-Diego, CA, USA www.ofcconference.org

Intengent's President and CEO Dr. Valery Tolstikhin will be participating in the overview of photonic integration landscape with a presentation: “Regrowth-Free Taper-Assistant Vertical Integration (TAVI) Platform for Fabless PICs in InP”

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Photonic Integration Week (PIW 2019)

January 14th 2019, Valencia, Spain piw.webs.upv.es

Intengent's President and CEO Dr. Valery Tolstikhin will be giving a talk: “Fabless PICs in InP Based on Taper-Assisted Vertical Integration Platform”

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Intengent has been profiled in the Compound Semiconductor magazine, in the article “Photonics ICs Prepped For Market” ()

sime2 www.semiconductor-today.com/news_items/2018/jan/gcs-intengent_260118.shtml

Intengent, Global Communication Semiconductors (GCS), and VLC Photonics partner on one-stop fabless development services for InP PICs